Core technology supporting OSRDA: MONSTER PAC(R)
Not only solving the issues of joining temperature, but also freeing from the thermal expansion and contraction of materials! Enabling high-precision implementation.
We would like to introduce our technology, "MONSTER PAC(R)." In the IoT sector, chips and film substrates, even if high-performance, have sometimes been unable to withstand solder mounting. Our technology achieves a mounting temperature of 80°C to 170°C through low-temperature bonding using conductive paste. This not only resolves the issue of bonding temperature but also frees materials from thermal expansion and contraction, enabling narrow pitches of 40μm or less and high-precision mounting of 3μm or less. 【Features】 ■ Low-temperature bonding using conductive paste ■ Achieves mounting temperatures of 80°C to 170°C ■ Frees materials from thermal expansion and contraction ■ Enables high-precision mounting *For more details, please refer to the PDF document or feel free to contact us.
- Company：コネクテックジャパン
- Price：Other
